Measurement of via currents in printed circuit boards using inductive loops

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2006, Pages 37-40

  Weaver, James A ^a   Horowitz, Mark A ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AC CURRENTS; BALL GRID ARRAY (BGA) PACKAGES; CIRCUIT BOARDS; ELECTRICAL PERFORMANCES; ELECTRONIC PACKAGING; INDUCTIVE LOOPS; POWER DISTRIBUTION NETWORK (PDN); TEST STRUCTURES;

DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC CURRENTS; ELECTRIC POWER DISTRIBUTION; ELECTRIC POWER GENERATION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

CUTOFF FREQUENCY;

EID: 47949092840     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2006.321184     Document Type: Conference Paper

References (6)

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