The curing reaction kinetics of epoxy/anhydride/silica systems

Journal of Polymer Engineering

Volumn 28, Issue 3, 2008, Pages 155-167

  Díaz, Esperanza ^a,b   Anasagasti, Soledad ^a   González, Javier ^a  

^a UNIVERSITY OF THE BASQUE COUNTRY UPV EHU   (Spain)

^b NONE   (Spain)

Author keywords

DSC; Epoxy; Pthalic acid anhydride (FPA); Silica; Tetrahydropthalic acid anhydride

Indexed keywords

ACTIVATION ENERGY; ASSOCIATION REACTIONS; CRACKS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS TRANSITION; ISOTHERMS; SILICA;

ACID ANHYDRIDE; CURING REACTION KINETICS; CURING TEMPERATURE; ELECTRICITY INDUSTRY; EPOXY; NON ISOTHERMAL DIFFERENTIAL SCANNING CALORIMETRY; PRODUCTION PROCESS; STRUCTURAL DEFECT;

REACTION KINETICS;

EID: 47649118781     PISSN: 03346447     EISSN: None     Source Type: Journal    
DOI: 10.1515/POLYENG.2008.28.3.155     Document Type: Article

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