Cure behavior of an epoxy-anhydride-imidazole system

Polymer Journal

Volumn 28, Issue 5, 1996, Pages 407-411

  Park, Won Ho ^a   Lee, Jong Keun ^a   Kwon, Kee Jeong ^b  

^a Kumoh National Institute of Technology   (South Korea)

^b 288 11 Cheil Ciba Geigy Co Ltd   (South Korea)

Author keywords

Anhydride; Epoxy; Esterification; Etherification; Glass Transition Temperature; Imidazole

Indexed keywords

BISPHENOL; DIGLYCIDYL ETHER; EPOXY ANHYDRIDE SYSTEM; ETHERIFICATION; EXOTHERMIC PEAKS; IMIDAZOLE DERIVATIVES; PLATEAUS;

ACTIVATION ENERGY; CURING; DERIVATIVES; DIFFERENTIAL SCANNING CALORIMETRY; ESTERIFICATION; GLASS TRANSITION; MIXTURES; POLYETHERS; STRUCTURE (COMPOSITION); TEMPERATURE; THERMAL EFFECTS;

EPOXY RESINS;

EID: 0029717922     PISSN: 00323896     EISSN: None     Source Type: Journal    
DOI: 10.1295/polymj.28.407     Document Type: Article

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