Effect of the oxygen flow rate on the structure and the properties of Ag-Cu-O sputtered films deposited using a Ag/Cu target with eutectic composition

Applied Surface Science

Volumn 254, Issue 20, 2008, Pages 6590-6594

  Pierson, J F ^a   Rolin, E ^a   Clement Gendarme C ^a   Petitjean, C ^a   Horwat, D ^a  

^a INSTITUT JEAN LAMOUR   (France)

Author keywords

Electrical properties; Nanostructured films; Reactive sputtering; Silver copper oxides; Structure

Indexed keywords

BINARY ALLOYS; COMPOSITE FILMS; ELECTRIC PROPERTIES; ENERGY DISPERSIVE X RAY ANALYSIS; FLOW RATE; OXYGEN; REACTIVE SPUTTERING; REFLECTION; STRUCTURE (COMPOSITION); SUBSTRATES; ULTRAVIOLET VISIBLE SPECTROSCOPY; X RAY DIFFRACTION;

DEPOSITION CHAMBERS; EUTECTIC COMPOSITION; FOUR-POINT PROBE METHOD; NANOSTRUCTURED FILMS; OXYGEN CONCENTRATIONS; OXYGEN FLOW RATES; SILVER-COPPER OXIDES; UV VISIBLE SPECTROSCOPY;

COPPER OXIDES;

EID: 47549090031     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.04.026     Document Type: Article

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