-
1
-
-
0028543174
-
Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules
-
US Patent No. 5,429,689
-
Shangguan, P., Achari, A., Green, W., "'Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules'", IEEE Transactions CPMT-Part B. 17, 4, 603-611. 1994. US Patent No. 5,429,689.
-
(1994)
IEEE Transactions CPMT-Part B.
, vol.17
, Issue.4
, pp. 603-611
-
-
Shangguan, P.1
Achari, A.2
Green, W.3
-
3
-
-
4744366341
-
Lead-free solder development-hybrid products applications
-
Shangguan, D., "'Lead-Free Solder Development-Hybrid Products Applications'", Ford Internal Technical Report, 1993.
-
(1993)
Ford Internal Technical Report
-
-
Shangguan, D.1
-
5
-
-
0003552729
-
Lead-free solder development for automotive electronics packaging applications
-
California
-
Shangguan, D., Achari, A., "'Lead-Free Solder Development for Automotive Electronics Packaging Applications'", Proceedings Surface Mount International Conference, California, 423-428, 1995.
-
(1995)
Proceedings Surface Mount International Conference
, pp. 423-428
-
-
Shangguan, D.1
Achari, A.2
-
6
-
-
0028758089
-
Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications
-
USA
-
Shangguaan, D., Achari, A., "'Evaluation of Lead-Free Eutectic Sn-Ag Solder for Automotive Electronics Packaging Applications'", Proceedings international Electronics Manufacturing Technology Symposium, USA, 25-37, 1994.
-
(1994)
Proceedings International Electronics Manufacturing Technology Symposium
, pp. 25-37
-
-
Shangguaan, D.1
Achari, A.2
-
7
-
-
0029702017
-
LCI for automotive electronic systems: Substitution assessment of Ag-Sn for Pb-Sn solder at ford motor company
-
USA
-
Costic, M., Sullivan, J., Bryant, B., Shangguan, D., "'LCI for Automotive Electronic Systems: Substitution Assessment of Ag-Sn for Pb-Sn Solder at Ford Motor Company'", Proceedings International Symposium on Electronics & the Environment, USA, 58-63, 1996.
-
(1996)
Proceedings International Symposium on Electronics & the Environment
, pp. 58-63
-
-
Costic, M.1
Sullivan, J.2
Bryant, B.3
Shangguan, D.4
-
8
-
-
0029478217
-
Measurement of thermal conductivity and specific heat of lead-free solder
-
USA
-
Lloyd, J. R., Zhang, C., Tan, H. L., Shangguan, D., Achari, A., "'Measurement of Thermal Conductivity and Specific Heat of Lead-Free Solder'", Proceedings IEEE CPMT International Electronics Manufacturing Technology Symposium, USA, 252-262, 1995.
-
(1995)
Proceedings IEEE CPMT International Electronics Manufacturing Technology Symposium
, pp. 252-262
-
-
Lloyd, J.R.1
Zhang, C.2
Tan, H.L.3
Shangguan, D.4
Achari, A.5
-
9
-
-
0025565345
-
Mechanical characteristics of 96.5Sn-3.5Ag solder in micro-bonding
-
USA
-
Harada, M., Satoh, R., "'Mechanical Characteristics of 96.5Sn-3.5Ag Solder in Micro-Bonding'", Proceedings 40th Electronic Components and Technology Conference, USA, 510-517, 1990.
-
(1990)
Proceedings 40th Electronic Components and Technology Conference
, pp. 510-517
-
-
Harada, M.1
Satoh, R.2
-
10
-
-
0022673024
-
Some properties of soldered joints made with a tin-silver eutectic alloy
-
London, J., Ashall, D. W., "'Some Properties of Soldered Joints Made with a Tin-Silver Eutectic Alloy'", Brazing and Soldering, 10, 17-23, 1986.
-
(1986)
Brazing and Soldering
, vol.10
, pp. 17-23
-
-
London, J.1
Ashall, D.W.2
-
11
-
-
0023169718
-
Fatigue of solders
-
Marshall, J. L., Walter S. R., "'Fatigue of Solders'", The International Journal for Hybrid Microelectronics, 10(11), 11-17, 1987.
-
(1987)
The International Journal for Hybrid Microelectronics
, vol.10
, Issue.11
, pp. 11-17
-
-
Marshall, J.L.1
Walter, S.R.2
-
12
-
-
0017006399
-
High strength, low temperature bonding with silver-tin solders
-
USA
-
Davies, R. L., "'High Strength, Low Temperature Bonding with Silver-Tin Solders'", Proceedings Fifth International Soldering Conference, USA, 838-842, 1976.
-
(1976)
Proceedings Fifth International Soldering Conference
, pp. 838-842
-
-
Davies, R.L.1
-
15
-
-
0029711578
-
Microstructural investigation of Sn-Ag an Sn-Pb-Ag solder joints
-
USA
-
Chada, S., Hermann, A., Laub, W., Foumelle, R., Shangguan, D., Achari, A., "'Microstructural Investigation of Sn-Ag an Sn-Pb-Ag Solder Joints'". Proceedings Nepcon West'96, USA, 195-205, 1996.
-
(1996)
Proceedings Nepcon West'96
, pp. 195-205
-
-
Chada, S.1
Hermann, A.2
Laub, W.3
Foumelle, R.4
Shangguan, D.5
Achari, A.6
-
16
-
-
4744341969
-
Effect of cooling rate and isothermal annealing on the microstructure of Sn-Ag and Sn-Pb-Ag solder
-
USA
-
Chada, S., Hermann, A., Laub, W., Fournelle, R., Shangguan, D., Achari, A., "'Effect of cooling Rate and Isothermal Annealing on the Microstructure of Sn-Ag and Sn-Pb-Ag Solder'", Symposium on Alloy Design and Soldering Technologies for Lead-Free and LeadBearing Solders, USA, 1995.
-
(1995)
Symposium on Alloy Design and Soldering Technologies for Lead-free and LeadBearing Solders
-
-
Chada, S.1
Hermann, A.2
Laub, W.3
Fournelle, R.4
Shangguan, D.5
Achari, A.6
-
17
-
-
85033291435
-
Effect of Cu dissolution on the microstructure of eutectic Sn-Ag solder joints
-
USA
-
Laub, W., Chada, S., Fournelle, R. A., Shangguan, D., "'Effect of Cu Dissolution on the Microstructure of Eutectic Sn-Ag Solder Joints'", ASM-TMS Materials Week'96, USA, 1996.
-
(1996)
ASM-TMS Materials Week'96
-
-
Laub, W.1
Chada, S.2
Fournelle, R.A.3
Shangguan, D.4
-
18
-
-
0344527219
-
How clean is clean: Effect of no-clean flux residues and environmental testing conditions on surface insulation resistance
-
USA
-
Sohn, J. E., Ray, M., Heideman, V., Schubert, B., Anderson, J. E., Adams, K. M., Waller, B., Ellenberger, G., Becka, G., "'How Clean Is Clean: Effect of No-Clean Flux Residues and Environmental Testing Conditions on Surface Insulation Resistance'", Proceedings Surface Mount International Conference, USA, 391. 1994.
-
(1994)
Proceedings Surface Mount International Conference
, pp. 391
-
-
Sohn, J.E.1
Ray, M.2
Heideman, V.3
Schubert, B.4
Anderson, J.E.5
Adams, K.M.6
Waller, B.7
Ellenberger, G.8
Becka, G.9
-
19
-
-
0028199306
-
Ionograph sensitivity to chemical residues from 'no clean' soldering fluxes: Comparison of solvent extract conductivity and surface conductivity
-
Adams, K., Anderson, J. E., Graves, Y. B., "'Ionograph Sensitivity to Chemical Residues from 'No Clean' Soldering Fluxes: Comparison of Solvent Extract Conductivity and Surface Conductivity'", Circuit World, 20, 2, 41, 1994.
-
(1994)
Circuit World
, vol.20
, Issue.2
, pp. 41
-
-
Adams, K.1
Anderson, J.E.2
Graves, Y.B.3
-
20
-
-
4744358682
-
Inert gas wave soldering evaluation
-
USA
-
Nation, B., Kneisel, L., Altpeter, J., "'Inert Gas Wave Soldering Evaluation'", International CFC and Halon Alternatives Conference, USA, 1993.
-
(1993)
International CFC and Halon Alternatives Conference
-
-
Nation, B.1
Kneisel, L.2
Altpeter, J.3
-
21
-
-
4744354686
-
Selection of no-clean fluxes and development of no-clean technology for automotive electronics assembly
-
China
-
Gao, G., Baker, J. D., Nation, B., Lemecha, M., Reddy, P., "'Selection of No-Clean Fluxes and Development of No-Clean Technology for Automotive Electronics Assembly'", International Conference on Alternatives to Ozone Depletion Substances, China, 1994.
-
(1994)
International Conference on Alternatives to Ozone Depletion Substances
-
-
Gao, G.1
Baker, J.D.2
Nation, B.3
Lemecha, M.4
Reddy, P.5
-
22
-
-
4744365250
-
Advantages of nitrogen inerted wave soldering
-
USA
-
Keegan, J., Chang, E., Saxena, N., "'Advantages of Nitrogen Inerted Wave Soldering'", Proceedings International Conference on Solder Fluxes and Pastes, USA, 1992.
-
(1992)
Proceedings International Conference on Solder Fluxes and Pastes
-
-
Keegan, J.1
Chang, E.2
Saxena, N.3
|