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Volumn 9, Issue 2, 1997, Pages 1-9

Lead-free and no-clean soldering for automotive electronics

Author keywords

Automotive industry; Electronics industry; Lead free soldering; No clean

Indexed keywords

AUTOMOTIVE ENGINEERING; COMPETITION; COST EFFECTIVENESS; ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; LEAD; MELTING; RELIABILITY; SOLDERING ALLOYS; TIN ALLOYS; TOXICITY; VIBRATIONS (MECHANICAL);

EID: 4744359870     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (1)

References (22)
  • 1
    • 0028543174 scopus 로고
    • Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules
    • US Patent No. 5,429,689
    • Shangguan, P., Achari, A., Green, W., "'Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules'", IEEE Transactions CPMT-Part B. 17, 4, 603-611. 1994. US Patent No. 5,429,689.
    • (1994) IEEE Transactions CPMT-Part B. , vol.17 , Issue.4 , pp. 603-611
    • Shangguan, P.1    Achari, A.2    Green, W.3
  • 3
    • 4744366341 scopus 로고
    • Lead-free solder development-hybrid products applications
    • Shangguan, D., "'Lead-Free Solder Development-Hybrid Products Applications'", Ford Internal Technical Report, 1993.
    • (1993) Ford Internal Technical Report
    • Shangguan, D.1
  • 5
    • 0003552729 scopus 로고
    • Lead-free solder development for automotive electronics packaging applications
    • California
    • Shangguan, D., Achari, A., "'Lead-Free Solder Development for Automotive Electronics Packaging Applications'", Proceedings Surface Mount International Conference, California, 423-428, 1995.
    • (1995) Proceedings Surface Mount International Conference , pp. 423-428
    • Shangguan, D.1    Achari, A.2
  • 10
    • 0022673024 scopus 로고
    • Some properties of soldered joints made with a tin-silver eutectic alloy
    • London, J., Ashall, D. W., "'Some Properties of Soldered Joints Made with a Tin-Silver Eutectic Alloy'", Brazing and Soldering, 10, 17-23, 1986.
    • (1986) Brazing and Soldering , vol.10 , pp. 17-23
    • London, J.1    Ashall, D.W.2
  • 17
  • 19
    • 0028199306 scopus 로고
    • Ionograph sensitivity to chemical residues from 'no clean' soldering fluxes: Comparison of solvent extract conductivity and surface conductivity
    • Adams, K., Anderson, J. E., Graves, Y. B., "'Ionograph Sensitivity to Chemical Residues from 'No Clean' Soldering Fluxes: Comparison of Solvent Extract Conductivity and Surface Conductivity'", Circuit World, 20, 2, 41, 1994.
    • (1994) Circuit World , vol.20 , Issue.2 , pp. 41
    • Adams, K.1    Anderson, J.E.2    Graves, Y.B.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.