Backward compatibility study of lead free area array packages with tin-lead soldering process

IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge

Volumn 2, Issue , 2006, Pages 863-871

  Nguyen, Jennifer ^a   Geiger, David ^a   Rooney, Daniel ^a   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

Backward compatibility; Backward compatible assembly; Lead free; Mixed alloy; Reflow temperature; SAC; Tin percentage

Indexed keywords

BACKWARD COMPATIBILITY; BACKWARD COMPATIBLE; LEAD-FREE; REFLOW TEMPERATURES; SAC;

ALLOYS; CUTTING TOOLS; EXHIBITIONS; LEAD; METALLURGY; OPTIMIZATION; PRINTED CIRCUITS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING; TIN ALLOYS;

TIN;

EID: 84867025077     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. D. Hillman, M. Wells, K. Cho, "The Impact of Reflowing a Lead-Free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity", http://www.aciusa.org/leadfree/lead-papers.htm
2. T. Gregorich, P.Holmes, "Low-Temperature, High-Reliability Assembly of Lead-Free CSPs", IPC Lead-Free Conference, Germany, 2003.
3. P. Snugovsky, A. Zbrzezny, M. Kelly, M. Romansky, "Theory and Practice of Lead-Free BGA Assembly using Sn-Pb Solder", IPC/Soldertec Lead-Free Conference, 2005.
4. B. Nandagopal, D. Chiang, S. Teng, P. Thume, L. Anderson, R. Jay, J. Bath, " Study on Assembly, Rework Process, Microstructures and Mechanical Strength of Backward Compatible Assembly", SMTA International Conference, 2005.
5. F. Hua, R. Aspandiar, T. Rothman, C. Anderson, G. Clemons, M. Klier, "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste". SMTA International Conference, 2002.