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Volumn , Issue , 2006, Pages 156-160

CFD simulations of LTCC based microsystems

Author keywords

[No Author keywords available]

Indexed keywords

BUILDING MATERIALS; COBALT; COMPUTATIONAL FLUID DYNAMICS; DYNAMICS; ELECTRONICS PACKAGING; FLUID DYNAMICS; FLUID MECHANICS; MICROSYSTEMS; SPRINGS (COMPONENTS); TECHNOLOGY;

EID: 46449137656     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2006.365377     Document Type: Conference Paper
Times cited : (8)

References (15)
  • 4
    • 7544241694 scopus 로고    scopus 로고
    • Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications
    • P. Khanna, B. Hornbostel, M. Burgard, W. Schafer, J. Dorner, "Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications", Materials Chemistry and Physics, Vol. 89, 2005, pp. 72-79.
    • (2005) Materials Chemistry and Physics , vol.89 , pp. 72-79
    • Khanna, P.1    Hornbostel, B.2    Burgard, M.3    Schafer, W.4    Dorner, J.5
  • 6
    • 46449104920 scopus 로고    scopus 로고
    • J. Santiago-Aviles, M. Gongora-Rubio, P. EspinozaVallejos, L. Sola-Laguna, Sensors, actuators and other non-packaging applications of LTCC tapes, Proc. IMAPS Conf. on Ceramic Interconnect Technology, Denver 2004, pp. 7-12.
    • J. Santiago-Aviles, M. Gongora-Rubio, P. EspinozaVallejos, L. Sola-Laguna, "Sensors, actuators and other non-packaging applications of LTCC tapes", Proc. IMAPS Conf. on Ceramic Interconnect Technology, Denver 2004, pp. 7-12.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.