Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications

Materials Chemistry and Physics

Volumn 89, Issue 1, 2005, Pages 72-79

  Khanna, P K ^a   Hornbostel, B ^a   Burgard, M ^a   Schafer W ^a   Dorner, J ^a  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA   (Germany)

Author keywords

Ceramics; Coatings; Crack; Multilayers

Indexed keywords

BONDING; CERAMIC MATERIALS; COATINGS; CRACKS; FUNCTIONS; LARGE SCALE SYSTEMS; LOW TEMPERATURE EFFECTS; MULTILAYERS;

LOW-TEMPERATURE-COFIRED CERAMICS; METALLIC PARTS; POST-FIRED MODULES; THREE-DIMENSIONAL MOLDING;

MICROELECTROMECHANICAL DEVICES;

EID: 7544241694     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2004.08.031     Document Type: Article

References (10)

1. M.R. Gongora-Robio, P. Espinoza-Vallejos, L. Sola-Laguna, J.J. Santiago-Avilés, Sens. Actuators A 89 (2001) 222.
2. N.L.A. Braga, S. Bampi, K. Shenai (Eds.), Proceedings of the XV SBMicro International Conference on Microelectronics and Packaging (SBμ), São Paulo, 2000, p. 189.
3. M. Gongora-Rubio, L.M. Solá-Laguna, P.J. Moffett, J.J. Santiaago-Avilés, Sens. Actuators 73 (1999) 215.
4. H. Teterycz, J. Kita, R. Bauer, L.J. Golonka, B.W. Licznerski, K. Nitsch, K. Wiśniewski, Sens. Actuators B 47 (1998) 100.
5. S. Slosarčik, J. Bansky, M. Dovica, M. Tkáč, J. Electrical Eng. 48 (1997) 250.
6. J. Zhong, M. Yi, H.H. Bau, Sens. Actuators A 96 (2002) 59.
7. J. Li, G.K. Ananthasuresh, J. Micromech. Microeng. 12 (2002) 198.
8. IMST GmbH: LTCC process, 2000. http://www.ltcc.de.
9. DuPont Microcircuit Materials: LTCC process, 2004. http://www.dupont.com/mcm/gtapesys/part3.html.
10. Reducing CTE mismatch between coatings and Si-based ceramics, Lewis Research Center. http://www.nasatech.com/Briefs/Jun98.