3-D Thermal modelling applied to stress-induced anisotropy of thermal conductivity

International Journal of Thermal Sciences

Volumn 43, Issue 12, 2004, Pages 1161-1169

  Pron, H ^a   Bissieux, C ^a  

^a UNIVERSITÉ DE REIMS CHAMPAGNE ARDENNE   (France)

Author keywords

Anisotropic conductivity; Lock in detection; Mechanical stress; Non destructive testing; Photothermal thermography; Thermal modelling

Indexed keywords

ANISOTROPY; CARBON STEEL; COMPUTER SIMULATION; DATA ACQUISITION; DIFFUSION; FOURIER TRANSFORMS; LOADING; PARAMETER ESTIMATION; PHOTODIODES; SPECIFIC HEAT; STRESSES; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

ANISOTROPIC CONDUCTIVITY; LOCK-IN DETECTION; MECHANICAL STRESS; NON-DESTRUCTIVE TESTING; PHOTOTHERMAL THERMOGRAPHY; THERMAL MODELING;

THERMAL CONDUCTIVITY;

EID: 4644338234     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2004.04.006     Document Type: Article

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