Kinetics of high-temperature deformation of polycrystalline OFHC copper and the role of dislocation core diffusion

Philosophical Magazine

Volumn 84, Issue 28, 2004, Pages 3039-3050

  Prasad, Y V R K ^a   Rao, K P ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DEFORMATION; GRAIN BOUNDARIES; OSCILLATIONS; PLASTIC FLOW; POLYCRYSTALLINE MATERIALS; STRAIN; THERMOCOUPLES;

ACTIVATION PARAMETERS; CORE DIFFUSION; OXYGEN-FREE HIGH CONDUCTIVITY (OFHC); STRESS-STRAIN BEHAVIOR;

KINETIC THEORY;

EID: 4644330078     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/14786430410001716205     Document Type: Article

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