Participation of non-compact dislocation guide in creep of copper at high temperatures

Materials Science and Engineering: A

Volumn 302, Issue 2, 2001, Pages 294-299

  Kvapilová, Marie ^a   Orlová, Alena ^a  

^a INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

Activation enthalpy; Copper; High temperature creep; Lattice self diffusion; Non compact dislocation glide; Rate controlling process

Indexed keywords

COPPER; CREEP; ENTHALPY; HIGH TEMPERATURE CORROSION;

EID: 0035972135     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01816-5     Document Type: Article

References (21)