Effect of an Ag buffer layer on a Cu/Ag/Si system

Applied Surface Science

Volumn 237, Issue 1-4, 2004, Pages 156-160

  Yukawa, M ^a   Kitagawa, H ^a   Iida, S ^a  

^a OSAKA SANGYO UNIVERSITY   (Japan)

Author keywords

Ag film; Buffer layer; Cu electrode; Cu film; Si substrate; Thin film

Indexed keywords

DIFFUSION; ELECTRIC WIRING; ELECTRODES; SILICON; SILVER; SUBSTRATES; SURFACE PROPERTIES; THIN FILMS;

AG FILM; CU ELECTRODES; CU FILM; SI SUBSTRATES;

COPPER COMPOUNDS;

EID: 4644319126     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(04)01001-3     Document Type: Conference Paper

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