Hardening mechanisms of nanocrystalline Ti-Al-N solid solution films

Thin Solid Films

Volumn 468, Issue 1-2, 2004, Pages 161-166

  Liu, Z J ^a   Shum, P W ^a   Shen, Y G ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Hardening mechanisms; Sputtering; Titanium aluminum nitride

Indexed keywords

DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; HARDNESS; INDENTATION; MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; OXIDATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEGREGATION (METALLOGRAPHY); STRUCTURE (COMPOSITION); X RAY DIFFRACTION ANALYSIS;

HARDENING MECHANISM; INTRINSIC HARDENING; LATTICE DISTORTION; TITANIUM ALUMINUM NITRIDE;

TITANIUM COMPOUNDS;

EID: 4644294099     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.087     Document Type: Article

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