Compositional effects on microstructure evolution and microwave properties of silver-palladium based thick film microstrips

Journal of Materials Science: Materials in Electronics

Volumn 15, Issue 11, 2004, Pages 751-755

  Rane, Sunit ^a   Deshpande, Varsha ^a   Seth, Tanay ^a   Phatak, Girish ^a   Amalnerkar, Dinesh ^a   Ayer, Rohini ^b  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

^b UNIVERSITY OF PUNE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPOSITION EFFECTS; ELECTRIC CONDUCTORS; ELECTRIC IMPEDANCE; ELECTRIC RESISTANCE; MICROSTRIP DEVICES; MICROSTRUCTURE; MICROWAVES; PALLADIUM; PALLADIUM ALLOYS; SURFACE STRUCTURE; THICK FILMS;

MICROELECTRONIC CIRCUITS; MICROSTRUCTURE EVOLUTION; SILVER PALLADIUM PASTE; THICK FILM MICROSTRIPS;

SILVER ALLOYS;

EID: 4644265705     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSE.0000043424.19400.cf     Document Type: Article

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