|
|
Volumn 23, Issue 3, 2000, Pages 163-173
|
|
A study on effect of line width, composition and firing temperature on the microstripline properties
|
|
Author keywords
Fritless thick film paste; Microstriplines; Transmittance
|
|
Indexed keywords
ALUMINA;
BINDERS;
COPPER;
REFLECTION;
SILVER;
SUBSTRATES;
THERMAL EFFECTS;
THICK FILMS;
THIN FILM CIRCUITS;
THIN FILMS;
COPPER THIN FILM CIRCUIT;
FRITLESS THICK FILM PASTE;
THICK FILM MICROSTRIPLINES;
TRANSMITTANCE;
MICROSTRIP LINES;
|
|
EID: 0034441986
PISSN: 08827516
EISSN: None
Source Type: Journal
DOI: 10.1155/APEC.23.163 Document Type: Article |
|
Times cited : (5)
|
|
References (18)
|
