Tensile bond strength of one-step self-etch adhesives to Er:YAG laser-irradiated and non-irradiated enamel

Dental Materials Journal

Volumn 27, Issue 3, 2008, Pages 386-391

  Kameyama, Atsushi ^a   Kato, Junji ^a   Aizawa, Koya ^a   Suemori, Tsuyoshi ^a   Nakazawa, Yuichi ^a   Ogata, Tsuyoshi ^a   Hirai, Yoshito ^a  

^a TOKYO DENTAL COLLEGE   (Japan)

Author keywords

Bond strength; Er:YAG laser; One step adhesive

Indexed keywords

AQ BOND; CLEARFIL AP X; CLEARFIL AP-X; CLEARFIL S3 BOND; CLEARFIL SE BOND; DENTIN BONDING AGENT; G BOND; G-BOND; INORGANIC COMPOUND; METAFIL C; METHACRYLIC ACID DERIVATIVE; RESIN; RESIN CEMENT; SILICON CARBIDE; SILICON DERIVATIVE; SOLARE;

ANIMAL; ARTICLE; CATTLE; CHEMISTRY; DENTAL BONDING; ENAMEL; MECHANICAL STRESS; RADIATION EXPOSURE; SCANNING ELECTRON MICROSCOPY; SOLID STATE LASER; SURFACE PROPERTY; TENSILE STRENGTH; ULTRASTRUCTURE;

ANIMALS; CARBON COMPOUNDS, INORGANIC; CATTLE; COMPOSITE RESINS; DENTAL BONDING; DENTAL ENAMEL; DENTIN-BONDING AGENTS; LASERS, SOLID-STATE; METHACRYLATES; MICROSCOPY, ELECTRON, SCANNING; RESIN CEMENTS; SILICON COMPOUNDS; STRESS, MECHANICAL; SURFACE PROPERTIES; TENSILE STRENGTH;

EID: 46249110114     PISSN: 02874547     EISSN: None     Source Type: Journal    
DOI: 10.4012/dmj.27.386     Document Type: Article

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