Fully optimized Cu based process with dedicated cavity etch for 1.75μm and 1.45μm pixel pitch CMOS Image Sensors

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2006, Pages

  Cohen, M ^a   Roy, F ^a   Herault, D ^a   Cazaux, Y ^a   Gandolfi, A ^a   Reynard, J P ^a   Cowache, C ^a   Bruno, E ^a   Girault, T ^a   Vaillant, J ^a   Barbier, F ^a   Sanchez, Y ^a   Hotellier, N ^a   Le Borgne, O ^a   Augier, C ^a   Inard, A ^a   Jagueneau, T ^a   Zinck, C ^a   Michailos, J ^a   Mazaleyrat, E ^a  

^a STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPYING; ELECTRON DEVICES; IMAGE SENSORS; IMAGING TECHNIQUES; OPTICAL DESIGN; SENSORS;

CMOS IMAGE SENSORS; CMOS IMAGER; CONVERSION GAINS; CU BASED; DARK CURRENTS; INNOVATIVE PROCESSES; PIXEL PITCHES;

PIXELS;

EID: 46049116691     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2006.346976     Document Type: Conference Paper

References (9)

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