Electrospray deposition of photoresist: A low impact method for the fabrication of multilayered films

Macromolecular Materials and Engineering

Volumn 293, Issue 5, 2008, Pages 387-399

  Rietveld, Ivo B ^a,b   Suganuma, Naotoshi ^a   Kobayashi, Kei ^a   Yamada, Hirofumi ^a   Matsushige, Kazumi ^a  

^a KYOTO UNIVERSITY   (Japan)

^b UNIVERSITÉ PARIS DESCARTES   (France)

Author keywords

Electrohydrodynamic atomization; Morphology control; Photolithography; Photoresist; Thin films

Indexed keywords

CLADDING (COATING); COATINGS; ELECTROMAGNETIC WAVE ABSORPTION; ENERGY ABSORPTION; MICROFLUIDICS; MORPHOLOGY; PHOTORESISTORS; SOLIDS; SPIN COATING; SUBSTRATES; SURFACE CHEMISTRY; SURFACE RELAXATION; SURFACE TENSION; SURFACE TREATMENT; SURFACES; THICK FILMS; THIN FILMS; VAPOR DEPOSITION;

CONCENTRATION (COMPOSITION); ELECTROSPRAY DEPOSITION (ESD); EQUILIBRIUM CONDITIONS; FILM MORPHOLOGY; MULTI-LAYERED; MULTI-LAYERED FILMS; PHOTOLITHOGRAPHIC PATTERNING; PHOTORESIST FILMS; PROCESS PARAMETERS; SPRAY CONDITIONS; SUBSTRATE SURFACES; SURFACE ENERGIES; THIN-FILM FABRICATION; VOLUME FLUX;

PHOTORESISTS;

EID: 45749145237     PISSN: 14387492     EISSN: 14392054     Source Type: Journal    
DOI: 10.1002/mame.200700419     Document Type: Article

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