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Volumn 6, Issue 2, 2007, Pages 213-219

Mechanism of interlayer dielectric penetration caused by Al interconnect and preventive measures

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; SILICON CARBIDE; SILICON COMPOUNDS; WIDE BAND GAP SEMICONDUCTORS;

EID: 45749095410     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2731187     Document Type: Conference Paper
Times cited : (3)

References (8)
  • 4
    • 85069487734 scopus 로고    scopus 로고
    • W. M. Berger, R. S. Keen and G. L. Schnable, Reliability Phenomena in Aluminum Metalizations on Silicon Dioxide, Symposium on the Physics of Failure in Electronics (Chicago, IL, 1965): RADC Series in Reliability, 1, p. 1, M. E. Goldberg and J. Vaccono, Editors, (1966).
    • W. M. Berger, R. S. Keen and G. L. Schnable, Reliability Phenomena in Aluminum Metalizations on Silicon Dioxide, Symposium on the Physics of Failure in Electronics (Chicago, IL, 1965): RADC Series in Reliability, Vol. 1, p. 1, M. E. Goldberg and J. Vaccono, Editors, (1966).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.