Advanced packaging development for very low cost uncooled IRFPA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5640, Issue , 2005, Pages 107-116

  Astier, A ^a   Arnaud, A ^a   Ouvrier Buffet, J ^a   Yon, J ^a  

^a CEA GRENOBLE   (France)

Author keywords

Microbolometer; Vacuum packaging

Indexed keywords

AMORPHOUS SILICON; ELECTRONICS PACKAGING; INFRARED DETECTORS; LIGHT ABSORPTION; RESEARCH AND DEVELOPMENT MANAGEMENT; THERMOMETERS;

AMORPHOUS SILICON THERMOMETERS; MICROBOLOMETERS; ON CHIP PACKAGING STRUCTURES; VACUUM PACKAGING;

BOLOMETERS;

EID: 20044369212     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.579958     Document Type: Conference Paper

References (7)

1. R. Gooch, T. Schimert, Low-cost Wafer-Level Vacuum Packaging for MEMS, MRS bulletin, January 2003, pp.55-59.
2. M. Vilain, Procédés et dispositifs de fabrication de détecteurs de rayonnement, FR 2 822 541 French Patent, 2001.
3. F. Abelès, Recherches sur la propagation des ondes électromagnétiques sinusoïdales dans les milieux stratifiés Applications aux couches minces, Ann. De Physique, 5 (1950), 596-640.
4. T.M. Cotter, M.E. Thomas and W.J. Tropf, Handbook of optical constants in solids II, Academic Press, 1991, pp 899-918.
5. R. Legtenberg and H.A.C. Tilmans, Electrostatically driven vacuum encapsulated polysillicon resonators: Part I. Design and fabrication, Sensors and Actuators A, 45 (1994), 57-66.
6. M. Bartek, J.A. Foerster, R.F. Wolffenbutter, Vacuum sealing of microcavities using metal evaporation, Sensors and Actuators, A 61 (1997), 364-368.
7. Procédé de fermeture hermétique d'un event et microcomposant associé, EN 03 14864 French Application, 18 déc 2003