Immersion defectivity study with volume production immersion lithography tool for 45 nm node and below

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6924, Issue , 2008, Pages

  Nakano, Katsushi ^a   Nagaoka, Shiro ^a   Yoshida, Masato ^a   Iriuchijima, Yasuhiro ^a   Fujiwara, Tomoharu ^a   Shiraishi, Kenichi ^a   Owa, Soichi ^a  

^a NIKON CORPORATION   (Japan)

Author keywords

Bevel; Defectivity; DSA; Immersion; Topcoat; Topcoat less

Indexed keywords

AEROSPACE APPLICATIONS; ANALOG DIFFERENTIAL ANALYZERS; EXPOSURE METERS; LITHOGRAPHY; MICROFLUIDICS; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; OPTIMIZATION; SENSITIVITY ANALYSIS; SODIUM; TOOLS;

(E ,3E) PROCESS; (SPM) CLASSES; 45NM NODE; APPLIED (CO); CLUSTER TOOLS; COLLABORATIVE WORKS; DEFECT LEVEL (DL); DEFECT REDUCTION; DEFECTIVITY; DEFECTIVITY REDUCTION; EXPOSURE TOOLS; IMMERSION EXPOSURE; IMMERSION LITHOGRAPHY (IML); OPTICAL MICRO LITHOGRAPHY; PROCESS OPTIMIZATION; ROOT CAUSES; SOURCE ANALYSIS; TOOL CLEANING; TWO TYPES; VOLUME PRODUCTIONS;

DEFECTS;

EID: 45449115544     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.772270     Document Type: Conference Paper

References (6)

1. K. Sasaki et al., "Defect Reduction with Topcoat Less Photo Resist for 193nm Immersion Lithography", Presentation at the 3rd International Symposium on Immersion Lithography, Oct. 2006
2. S. Kanna et al., "Non topcoat resist design for immersion defectivity reduction", Presentation at the 3rd International Symposium on Immersion Lithography, Oct. 2006
3. N. Matsumura et al., "Process Development for High Speed Scanning ArF immersion Lithography", Proc. SPIE 6923-12, 2008
4. T. Iseki et al., "Application technology of stacked film with highly controlled edge", Proc. SPIE 6923-67, 2008
5. th International Symposium on Immersion Lithography, Sep. 2007
6. Katsushi Nakano, Soichi Owa, Irfan Malik, Tetsuya Yamamoto, and Somnath Nagb, "Analysis and improvement of defectivity in immersion lithography", Proc. SPIE 6154-175, 2006