Artificial neural networks and statistical modeling for electronic stress prediction using thermal profiling

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 1, 2004, Pages 49-58

  Hsieh, Sheng Jen ^a  

^a TEXAS A AND M UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKPROPAGATION; ELECTRONICS INDUSTRY; LEARNING ALGORITHMS; MATHEMATICAL MODELS; NEURAL NETWORKS; REGRESSION ANALYSIS; STATISTICAL METHODS; STRESS ANALYSIS; THERMAL EFFECTS;

ELECTRONIC STRESS PREDICTION; MULTIVARIATE REGRESSION MODELS; TEMPERATURE PROFILES; VOLTAGE STRESS LEVEL;

ELECTRONIC EQUIPMENT TESTING;

EID: 4544364265     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.830517     Document Type: Article

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