Nearly stress-free Cu/polyimide process for large format MCM manufacturing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 526-531

  Kovach, D J ^a   Amirgulyan, N S ^a   Chien, C P ^a   Tanielian, M H ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; CURING; ELECTRONICS PACKAGING; ELECTROPLATING; FAILURE ANALYSIS; METALLIZING; POLYIMIDES; RELIABILITY; RESIDUAL STRESSES; SPUTTER DEPOSITION;

COEFFICIENTS OF THERMAL EXPANSION; DEPTH OF FOCUS; WARPAGE;

MULTICHIP MODULES;

EID: 0033338053     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)