A micro-machined acoustic sensor array for fuel level indication

Sensors and Actuators, A: Physical

Volumn 115, Issue 2-3 SPEC. ISS., 2004, Pages 385-391

  Osborne, Rex ^a   Ward, Michael ^a   Dawkins, Ken ^a  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

Acoustic; Array; Automotive; Capacitive; Octophone; Sensor

Indexed keywords

ACOUSTIC DEVICES; DRY ETCHING; ELECTRON BEAMS; ELECTROSTATICS; FINITE ELEMENT METHOD; MICROMACHINING; NATURAL FREQUENCIES;

ACOUSTIC SENSORS; ELECTRON BEAM PATTERNING; FUEL LEVEL INDICATORS;

SENSORS;

EID: 4544299703     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.04.044     Document Type: Conference Paper

References (9)

1. Scheeper P., Van De Donk A., Olthius W., Bergveld P. Review of silicon microphones. Sens. Actuators. 1(3):1992;219.
2. Kovacs A., Stoffel A. Fabrication of single-chip polysilicon structures for microphone applications. Inst. Phys. ED-5:1995;86-90.
3. Bay J., Hansen O. Micromachined double back plate differential capacitive sensor. J. Micromech. Microeng., Inst. Phys. ED-9:1999;30-33.
4. J. Kung, H. Lee, An integrated air gap capacitor process for sensor applications, International Conference on Solid State Sensors Actuators and Transducers, San Francisco, 1991, pp. 1010-1030.
5. A. Allen, A Textbook of Practical Physics, vol. 1, Macmillan and Co. Ltd., London, 1916, pp. 200-204.
6. B. Blevins, Formulas for Natural Frequencies and Mode Shapes, vol. 1, Krieger Publishing, 1958, p. 199.
7. Bergqvist J., Gobet J. Capacitive microphone with a surface micromachined backplate using electroplating technology. J. Microelectromech. Syst. 3(2):1994;69-75.
8. Scheeper P., Van De Donk A., Olthius W., Bergveld P. Fabrication of silicon condenser microphones using single wafer technology. 1(3):1992;147-154.
9. L. Kinsler, B.A. Coppers, J. Sanders, A. Frey, Fundamentals of Acoustics, 3rd ed., Wiley, New York, pp. 200-242.