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Volumn 1, Issue , 2004, Pages 170-174
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Integration of a low stress photopatternable silicone into a Wafer Level Package
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Author keywords
[No Author keywords available]
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Indexed keywords
INTEGRATED CIRCUITS;
MICROELECTRONICS;
PRINTED CIRCUIT BOARDS;
SILICON WAFERS;
SILICONES;
SOLDERED JOINTS;
THERMAL CYCLING;
THERMAL EXPANSION;
LOW STRESS PHOTOPATTERNABLE SILICONE;
PLASMA CLEANING;
WAFER LEVEL PACKAGE;
ELECTRONICS PACKAGING;
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EID: 4544273683
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (18)
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References (7)
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