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Volumn 1, Issue , 2004, Pages 170-174

Integration of a low stress photopatternable silicone into a Wafer Level Package

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; SILICON WAFERS; SILICONES; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION;

EID: 4544273683     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (18)

References (7)
  • 2
    • 0037803022 scopus 로고
    • On the relation between soldering reliability and thin-film layer structure
    • Nagatsu, H., et. al., "On the relation between soldering reliability and thin-film layer structure". Review of the Electrical Communication Laboratories. Vol. 20, No. 3-4, 1972, pp. 327-344.
    • (1972) Review of the Electrical Communication Laboratories , vol.20 , Issue.3-4 , pp. 327-344
    • Nagatsu, H.1
  • 3
    • 0024171148 scopus 로고
    • Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability
    • Dec.
    • Lau, J., et. al., "Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability". IEEE Transactions on Reliability, Vol. 37, No. 5, Dec. 1988, pp. 524-530.
    • (1988) IEEE Transactions on Reliability , vol.37 , Issue.5 , pp. 524-530
    • Lau, J.1
  • 4
    • 0024037628 scopus 로고
    • Some reliability problems of surface-mounted devices
    • July
    • Muto, T. "Some reliability problems of surface-mounted devices". IEEE Circuits and Devices Magazine, Vol. 4, No. 4, July 1988, pp. 9-13.
    • (1988) IEEE Circuits and Devices Magazine , vol.4 , Issue.4 , pp. 9-13
    • Muto, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.