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Volumn 44, Issue 8, 2004, Pages 1414-1418

Numerical investigation of the influence of material properties and adhesive layer thickness on the heating efficiency of microwave curing of an adhesive-bonded joint

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; BONDING; COMPUTER SIMULATION; DIFFERENTIAL EQUATIONS; ELECTRIC FIELD EFFECTS; EPOXY RESINS; MATHEMATICAL MODELS; PARAMETER ESTIMATION; POLYPROPYLENES; THERMAL CONDUCTIVITY; TIME DOMAIN ANALYSIS;

EID: 4544262583     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.20137     Document Type: Article
Times cited : (5)

References (9)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.