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Volumn 44, Issue 8, 2004, Pages 1414-1418
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Numerical investigation of the influence of material properties and adhesive layer thickness on the heating efficiency of microwave curing of an adhesive-bonded joint
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE JOINTS;
BONDING;
COMPUTER SIMULATION;
DIFFERENTIAL EQUATIONS;
ELECTRIC FIELD EFFECTS;
EPOXY RESINS;
MATHEMATICAL MODELS;
PARAMETER ESTIMATION;
POLYPROPYLENES;
THERMAL CONDUCTIVITY;
TIME DOMAIN ANALYSIS;
HEATING EFFICIENCY;
MICROWAVE CURING;
NUMERICAL MODELS;
RADIATION ENERGY;
MICROWAVE HEATING;
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EID: 4544262583
PISSN: 00323888
EISSN: None
Source Type: Journal
DOI: 10.1002/pen.20137 Document Type: Article |
Times cited : (5)
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References (9)
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