Simulation and experimental study of microwave heating of single lap adhesive-bonded polypropylene joint

Polymer Engineering and Science

Volumn 44, Issue 4, 2004, Pages 728-735

  So, H W ^a   Taube, A ^a  

^a SWINBURNE UNIVERSITY OF TECHNOLOGY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; BOND STRENGTH (MATERIALS); COMPUTER PROGRAM LISTINGS; COMPUTER SIMULATION; DIELECTRIC LOSSES; FINITE DIFFERENCE METHOD; IRRADIATION; MATHEMATICAL MODELS; MICROWAVE HEATING; PLASTICS; TEMPERATURE DISTRIBUTION;

CURING PROCESS; DIELECTRIC LOSS FACTOR; WATER DUMMY TERMINAL LOAD;

POLYPROPYLENES;

EID: 2542519236     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.20065     Document Type: Article

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