Microindentation of ground silicon wafers

Semiconductor Science and Technology

Volumn 19, Issue 9, 2004, Pages 1165-1168

  Yang, Fuqian ^a   Fei, Peixing ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DEFORMATION; ELASTIC MODULI; INDENTATION; MICROELECTROMECHANICAL DEVICES; MICROHARDNESS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE PHENOMENA;

CHEMOMECHANICAL POLISING; MICROINDENTATION; SUBSURFACE DAMAGE; SURFACE DEGRADATION;

SILICON WAFERS;

EID: 4544250696     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/19/9/017     Document Type: Article

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