Reduction in helium thermal conductivity by 1 mgcc silica aerogel foam

Applied Physics Letters

Volumn 92, Issue 22, 2008, Pages

  Kugland, N L ^a   Moody, J D ^b   Kozioziemski, B J ^b   Rubenchik, A M ^b   Niemann, C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROGELS; CERAMIC MATERIALS; COLLOIDS; HELIUM; INERT GASES; MICROFLUIDICS; NUCLEAR PHYSICS; PRESSURE; RADIOACTIVITY; RANGE FINDING; REDUCTION; SILICA; SILICA GEL; SILICATE MINERALS; SILICON COMPOUNDS; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

(P ,P ,T) MEASUREMENTS; AMERICAN INSTITUTE OF PHYSICS (AIP); HELIUM GAS; HIGHER TEMPERATURES; HOT WIRE METHOD; MEAN FREE PATH (MFP); SILICA AEROGELS; SIMPLE MODELING; ULTRA LOW DENSITY;

THERMAL CONDUCTIVITY OF GASES;

EID: 44849094746     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2938883     Document Type: Article

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