Evaluation of the interfacial bonding between fibrous substrate and sputter coated copper

Surface and Coatings Technology

Volumn 202, Issue 19, 2008, Pages 4673-4680

  Wei, Qufu ^a   Xu, Qiuxiang ^a   Cai, Yibing ^a   Wang, Yingying ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

AFM; Copper; Interfaces; Polypropylene; Sputtering

Indexed keywords

ABRASION; ADHESION; COPPER ALLOYS; POLYPROPYLENES; SPUTTER DEPOSITION;

INTERFACIAL BONDING; PEEL-OFF TEST;

BOND STRENGTH (MATERIALS);

ABRASION; ADHESION; BOND STRENGTH (MATERIALS); COPPER ALLOYS; POLYPROPYLENES; SPUTTER DEPOSITION;

EID: 44649191769     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.03.037     Document Type: Article

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