Enhancement of cooling characteristics for electronic cooling by modifying substrate under natural convection

Journal of Electronic Packaging

Volumn 130, Issue 1, 2008, Pages 0110061-0110068

  Tseng, Yung Shin ^a   Hung, Tzu Chen ^b   Pei, Bau Shei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

Author keywords

CFD; Experimental; Opening concept; Thermal solution

Indexed keywords

BOUNDARY LAYERS; COMPUTATIONAL FLUID DYNAMICS; NATURAL CONVECTION; THERMAL EFFECTS;

DESIGN FREEDOM; MANUFACTURING COST; THERMAL SOLUTION;

COOLING;

EID: 44449163483     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2837524     Document Type: Article

References (25)

1. Bar-Cohen, A., Kraus, A. D., and Davidson, S. F., 1983, "Thermal Frontiers in the Design and Packaging of Microelectronic Equipment," Mech. Eng. (Am. Soc. Mech. Eng.), 105(6), pp. 53-59.
2. Yeh, L. T., 1995, "Review of Heat Transfer Technologies in Electronic Equipment," ASME J. Electron. Packag., 117, pp. 333-339.
3. Sparrow, E. M., Yanezmoreno, A. A., and Otis, D. R., 1984, "Convective Heat Transfer Response to Height Differences in an Array of Block-Like Electronic Components," Int. J. Heat Mass Transfer, 27, pp. 469-473.
4. Sparrow, E. M., Verumi, S. B., and Kadle, D. S., 1983, "Enhanced and Local Heat Transfer, Pressure Drop, and Flow Visualization for Arrays of Block-Like Electronic Components," Int. J. Heat Mass Transfer, 27, pp. 689-699.
5. Peterson, G. P., and Ortega, A., 1990, "Thermal Control of Electronic Equipment and Devices," Adv. Heat Transfer, 20, pp. 181-314.
6. Hung, T. C., Wang, S. K., and Tsai, F. P., 1997, "Simulations of Passively Enhanced Conjugate Heat Transfer across an Array of Volumetric Heat Sources," Commun. Numer. Methods Eng., 13, pp. 855-866.
7. Hung, T. C., and Fu, C. S., 1999, "Conjugate Heat Transfer Analysis for the Passive Enhancement of Electronic Cooling Through Geometric Modification in a Mixed Convection Domain," Numer. Heat Transfer, Part A, 35, pp. 519-535.
8. Hung, T. C., 2001, "A Conceptual Design of Thermal Modeling for Efficiently Cooling an Array of Heated Devices Under Low Reynolds Numbers," Numer. Heat Transfer, Part A, 39, pp. 361-382.
9. Aghazadeh, M., and Mallik, D., 1990, "Thermal Characteristic of Single and Multilayer High Performance PQFP Packages," IEEE Trans. Compon., Hybrids, Manuf. Technol., 20(2), pp. 975-979.
10. Ridsdle, G., Joiner, B., Bigler, J., and Torres, V. M., 1994, "Thermal Performance Limits of the QFP Family," IEEE Trans. Compon., Hybrids, Manuf. Technol., 17(4), pp. 427-443.
11. Edwards, D. R., Hwang, M., and Stearns, B., 1995, "Thermal Enhancement of Plastic IC packages," IEEE Trans. Compon., Hybrids, Manuf. Technol., 18(1), pp. 57-67.
12. Tseng, Y. S., Hung, T. C., and Pei, B. S., 2007, "The Effects of Thermal Radiation for Electronic Cooling on Modified PCB Geometry Under Natural Convection," Numer. Heat Transfer, Part A, 51, pp. 195-210.
13. ELVJEDEC Standard, 1995, "Integrated Circuits Thermal Test Method Environment Conditions-Natural Convection (Still Air)," Report No. TIS/ JESD51-2.
14. Incropera, F. P., and DeWitt, D. P., 1996, Fundamentals of Heat and Mass Transfer, 4th ed., Wiley, New York, Chap. 13, pp. 719 and 733.
15. Chui, E. H., and Raithby, G. D., 1993, "Computation of Radiant Heat Transfer on a Non-Orthogonal Mesh Using the Finite-Volume Method," Numer. Heat Transfer, Part B, 23, pp. 269-288.
16. Chai, J. C., Lee, H. S., and Patanker, S. V., 1995, "Finite Volume Radiative Heat Transfer Procedure for Irregular Geometries," J. Thermophys. Heat Transfer, 9(3), pp. 410-415.
17. Kim, M. Y., and Baek, S. W., 1996, "Numerical Analysis of Conduction, Convection, and Radiation in a Gradually Expanding Channel," Numer. Heat Transfer, Part A, 29(7), pp. 725-740.
18. Baek, S. W., and Kim, M. Y., 1998, "Nonorthogonal Finite-Volume Solutions of Radiative Heat Transfer in a Three-Dimensional Enclosure," Numer. Heat Transfer, Part B, 34(4), pp. 419-437.
19. Liu, J. S., Shang, H. M., Chen, Y. S., and Wang, T. S., 1997, "Prediction of Radiative Transfer in General Body-Fitted Coordinates," Numer. Heat Transfer, Part B, 31, pp. 423-439.
20. Vandoormaal, J. P., and Raithby, G. D., 1984, "Enhancements of the SIMPLE Method for Predicting Incompressible Fluid Flows," Numer. Heat Transfer, 7, pp. 147-163.
21. Raithby, G. D., and Chui, E. H., 1990, "A Finite-Volume Method for Predicting a Radiant Heat Transfer in Enclosures With Participating Media," ASME J. Eng. Gas Turbines Power, 112, pp. 415-423.
22. Murthy, J. Y., and Mathur, S. R., 1998, "A Finite Volume Method for Radiative Heat Transfer Using Unstructured Meshes," Paper No. AIAA-98-0860.
23. Hottel, H. C., 1930, "Radiant Heat Transmissions," Mech. Eng. (Am. Soc. Mech. Eng.), 52, pp. 699-704.
24. Goldstein, R. J., Sparrow, E. M., and Jones, D. C., 1973, "Natural Convection Adjacent to Horizontal Plates," Int. J. Heat Mass Transfer, 16, pp. 1025-1034.
25. Lloyd, J. R., and Moran, W. R., 1974, "Natural Convection Adjacent to Horizontal Surface of Various Plan forms," ASME Paper No. WA/HT-66.