A conceptual design of thermal modeling for efficiently cooling an array of heated devices under low reynolds numbers

Numerical Heat Transfer; Part A: Applications

Volumn 39, Issue 4, 2001, Pages 361-382

  Hung, J C ^a  

^a I SHOU UNIVERSITY   (Taiwan)

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EID: 1842638576     PISSN: 10407782     EISSN: None     Source Type: Journal    
DOI: 10.1080/10407780151063151     Document Type: Article

References (29)

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