Performance-cost optimization of a diamond heat spreader

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2008, Pages 65-72

  Rogacs, Anita ^a   Rhee, Jinny ^b  

^a STANFORD UNIVERSITY   (United States)

^b SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SOURCE; HEAT SPREADER; NEWTONIAN COOLING;

COMPUTER SIMULATION; HEAT CONVECTION; MATHEMATICAL MODELS; SYSTEMS ANALYSIS;

HEAT RESISTANCE;

EID: 44449159436     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2007.4419929     Document Type: Conference Paper

References (7)

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2. Hui, P., and Tan, H.S., "Temperature distributions in a heat dissipation system using a cylindrical diamond heat spreader on a copper heat sink," Jpn. J. Appl. Phys. Vol. 75, No. 2 (1994) pp. 748-757
3. Hui, P., Tso, C.P., and Tan, H.S., "A rigorous series solution for diamond heat spreaders with temperature-dependent thermal conductivity used in microwave power devices," Jpn. J. Appl. Phys. Vol. 35, No. 11, Part 1 (1996) pp. 5796-5804
4. Jagannadham, K., "Multilayer diamond heat spreaders for electronic power devices," Solid-State Electronics Vol. 42, No. 12, pp. 2199-2208
5. Ellison, G.N., "Maximum spreading resistance for rectangular sources and plates with nonunity aspect ratios,"IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 2 (June 2003) pp. 439-454
6. Lee, S., Song, S., Au, V., and Moran, K.P., "Constriction/Spreading Resistance Model for Electronics Packaging," proceedings of the ASME/JSME Engineering Conference, Vol. 5 (1995)
7. Dahlgren, S.S., and Hall, Jr., H.T., "High-pressure polycrystalline diamond as a cost effective heat spreader," proceedings of the 2000 IEEE InterSociety Conference on Thermal Phenomenon," Vol. 1, pp. 296-303, May 23-36, Las Vegas, NV