Three-dimensional analysis of a thermal dissipation system with a rectangular diamond heat spreader on a semi-infinite copper heat sink

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 9 A, 1996, Pages 4852-4861

  Hui, Ping ^a   Tan, Hong Siang ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Diamond heat spreaders; Heat sinks; IC packages

Indexed keywords

THERMAL DISSIPATION SYSTEMS;

BOUNDARY VALUE PROBLEMS; COPPER; ENERGY DISSIPATION; GEOMETRY; HEAT CONDUCTION; HEAT FLUX; HEAT SINKS; NUMERICAL ANALYSIS; SEMICONDUCTING DIAMONDS; THREE DIMENSIONAL;

HEAT TRANSFER;

EID: 0030232464     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.4852     Document Type: Article

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