Numerical study of conjugate heat transfer in stacked microchannels

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 372-380

  Patterson, Michael K ^a   Wei, Xiaojin ^b   Joshi, Yogendra ^b   Prasher, Ravi ^a  

^a INTEL CORPORATION   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Microchannel; Semiconductor cooling; Thermal management

Indexed keywords

MICROCHANNELS; SEMICONDUCTOR COOLING; THERMAL MANAGEMENT;

ASPECT RATIO; CHANNEL FLOW; COOLING; HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; PRESSURE DROP; SEMICONDUCTOR DEVICES;

HEAT SINKS;

EID: 4444377243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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