Planar spiral inductors with multilayer micrometer-scale laminated cores for compact-packaging power converter applications

IEEE Transactions on Magnetics

Volumn 40, Issue 4 II, 2004, Pages 2020-2022

  Park, Jin Woo ^a   Cros, Florent ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Compact packaging; Core lamination; Dc dc converter; Eddy current; Spiral power inductor

Indexed keywords

EDDY CURRENTS; ELECTRIC CONVERTERS; ETCHING; FREQUENCIES; MAGNETIC CORES; MAGNETIC FLUX; MAGNETIC MATERIALS; MULTILAYERS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

COMPACT PACKAGING; CORE LAMINATION; DC-DC CONVERTERS; SPIRAL POWER INDUCTORS;

ELECTRIC INDUCTORS;

EID: 4444356085     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2004.832159     Document Type: Article

References (4)

1. S. Ramakrishnan, R. L. Steigerwald, and J. A. Mallick, "A comparison study of low-profile power magnetics forhigh-frequency, high-density switching converters," in Proc. APEC, Feb. 1997, pp. 388-394.
2. J. Park, F. Cros, and M. Allen, "A sacrificial layer approach to highly laminated magnetic cores," in Proc. 15th IEEE Int. Conf. MEMS, Jan. 2002, pp. 380-383.
3. C. R. Sullivan and S. R. Sanders, "Exploiting the third dimension in power electronics packaging," in Proc. Power Electronics Specialists Conf., June 1995, pp. 658-664.
4. J. Park, "Core lamination technology for micromachined power inductive components," Ph.D. thesis, Georgia Inst. Technol., Atlanta, GA, Dec. 2003.