Method for Paste Selection and Process Optimisation for Fine‐pitch SMT

Soldering & Surface Mount Technology

Volumn 8, Issue 3, 1996, Pages 9-11

  Gagne, D ^a   Quaglia, M ^a   Shina, S G ^a  

^a UNIVERSITY OF MASSACHUSETTS LOWELL   (United States)

Author keywords

Fine pitch components; Optimisation; Paste

Indexed keywords

ASSEMBLY; ELECTRONICS INDUSTRY; ENVIRONMENTAL IMPACT; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SOLDERING; ADHESIVE PASTES; PROBLEM SOLVING;

PASTE SELECTION; SEQUENTIAL INVESTIGATION PROCESS; SOLDER PASTE; FINE PITCH COMPONENTS; SOLDER PASTES; SURFACE MOUNT ELECTRONICS INDUSTRY;

SURFACE MOUNT TECHNOLOGY;

EID: 4744340017     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919610777690     Document Type: Article

References (0)