Power and temperature requirements for refrigerated systems

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 237-241

  Copeland, David ^a   Chan, Albert ^a  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

Author keywords

Junction temperature; Refrigeration; Static leakage; Total power

Indexed keywords

AIR COOLING; JUNCTION TEMPERATURE; STATIC LEAKAGE; TOTAL POWER;

COOLING; DOPING (ADDITIVES); ENERGY DISSIPATION; ENERGY UTILIZATION; LEAKAGE CURRENTS; MICROPROCESSOR CHIPS; PLATES (STRUCTURAL COMPONENTS); SILICON;

REFRIGERATION;

EID: 4444350795     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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