Study on alternative cooling methods beyond next generation microprocessors

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 97-102

  Chan, Albert ^a   Wei, Jie ^b  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

^b FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Heat sink; Liquid cooling; Microprocessor cooling; Refrigeration; Two phase convective cooling

Indexed keywords

CARBON DIOXIDE; COMPRESSORS; CONDENSERS (LIQUEFIERS); COST EFFECTIVENESS; FLOW OF WATER; FREEZING; HEAT CONVECTION; HEAT LOSSES; HEAT PUMP SYSTEMS; HEAT RESISTANCE; HEAT SINKS; LEAKAGE CURRENTS; MICROPROCESSOR CHIPS; RELIABILITY; THERMOELECTRIC REFRIGERATION; TWO PHASE FLOW; ELECTRONICS PACKAGING; FLOW OF FLUIDS; LIQUIDS; PUMPS; REDUNDANCY; REFRIGERATION; TEMPERATURE; THERMOANALYSIS;

LIQUID COOLING; MICROPROCESSOR COOLING; TWO-PHASE CONVECTIVE COOLING; AMBIENT PRESSURES; CONVECTIVE COOLING; CONVECTIVE FLOW; COOLING METHODS; FEASIBILITY STUDIES; FIELD SERVICES; FLUID FLOW RATES; HEAT DISSIPATION; HEAT PUMPS; HIGH-TO-LOW; LOW COSTS; LOW-TO-HIGH; OPERATING CONDITION; REFRIGERATION COOLING; TECHNOLOGY NODES; THERMO DYNAMIC ANALYSIS;

COOLING SYSTEMS; COOLING;

EID: 1242264436     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35041     Document Type: Conference Paper

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