Factors influencing the interfacial width of copper gradients on gold produced by spatiotemporal control of the in-plane electrochemical potential distribution: Electrode geometry and plating solution composition

Journal of Electroanalytical Chemistry

Volumn 571, Issue 2, 2004, Pages 139-148

  Coleman, Brian D ^a   Finnegan, Nancy ^b   Bohn, Paul W ^a,b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Deposition; Nucleation; Potential gradient

Indexed keywords

ADHESION; CONTAMINATION; DEPOSITION; ELECTRIC POTENTIAL; ELECTROPLATING; GOLD; MATHEMATICAL MODELS; NUCLEATION; SILICON; THIN FILMS; WETTING;

ELECTROCHEMICAL DEPOSITION; ELECTROCHEMICAL POTENTIALS; INTERFACIAL WIDTH; SPATIOTEMPORAL DISTRIBUTION;

COPPER;

EID: 4444293503     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2004.05.004     Document Type: Article

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