Development of flip-chip bonding technology for (Cd,Zn)Te

IEEE Transactions on Nuclear Science

Volumn 51, Issue 4 I, 2004, Pages 1799-1802

  Fiederle, Michael ^a   Braml, Heiko ^b   Fauler, Alex ^a   Giersch, Jürgen ^b   Ludwig, Jens ^a   Jakobs, Karl ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

CdTe; CdZnTe; Flip chip bonding; Pixel detector

Indexed keywords

ELECTRODE CRACKING; FLIP-CHIP BONDING; PIXEL DETECTORS; UNDER-BUMP METALLIZATION (UBM);

ELECTRON GUNS; ELECTROPLATING; PHOTORESISTORS; REACTIVE ION ETCHING; SEMICONDUCTING CADMIUM TELLURIDE; SINGLE CRYSTALS; VAPOR PRESSURE; ZINC COMPOUNDS;

FLIP CHIP DEVICES;

EID: 4444292736     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2004.832949     Document Type: Conference Paper

References (5)

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