A 70+GHz BW package for multigigabit IC applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2004, Pages 1209-1212

  Choudhury, Debabani ^a   Foschaar, James ^a   Bowen, Ross ^a   Mokhtari, Mehran ^a  

^a Hughes Aircraft Co   (United States)

Author keywords

Filled vias; High isolation; IC module; Multilayer substrate; Polyimide; Wideband package

Indexed keywords

FILLED VIAS; HIGH ISOLATION; IC MODULES; WIDEBAND PACKAGES;

BANDWIDTH; COST EFFECTIVENESS; INSERTION LOSSES; LOGIC DESIGN; MULTILAYERS; RESONANCE; SUBSTRATES; TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 4444245104     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M. Nakamura, "Challenges in Semiconductor Technology for Multi-Megabit Network Services", ISSCC Proceedings, pp. 16-20, February 1998.
2. K.Sano, K. Murata, S. Sugitani, H. Sugahara, T. Enoki, "50-Gb/s 4-b Multiplexer/Demultiplexer Chip-set using InP HEMTs" IEEE Journal of Solid State Circuits, vol. 38, No. 9, pp. 1504-1511, September 2003.
3. L. Shan, M. Meghelli, J-H Kim, J.M. Trewhella, M.M. Oprysko, "Simulation and design methodology for a 50-Gb/s Multiplexer/Demultiplexer Package" IEEE Trans. Advanced Packaging., vol.25, no.2,pp. 248-254, May 2002.
4. S. Yamaguchi, Y. Imai, S. Kimura, H. Tsunetsugu, "New Module Structure Using Flip-Chip Technology for high-speed Optical Communication ICs" 1996 IEEE MTT-S Int. Microwave Symp. Digest, vol. 1, pp. 243-246, June 1996.
5. M. Mokhtari et al., '100+ GHz Static Divide-By-2 Circuit in InP DHBT Technology', IEEE Journal of Solid State Circuits, pp.1540-1544, Vol.38, No.9, Sept. 2003
6. th IEEE International Symposium on Electron Devices for Microwave and Optoelectronic Applications, EDMO2003 Proceedings, pp.105-108, November 2003.