A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2004, Pages 477-480

  Engl, M ^a   Pressel, K ^a   Dangelmaier, J ^a   Theuss, H ^a   Eisener, B ^a   Eurskens, W ^a   Knapp, H ^a   Simburger W ^a   Weigel, R ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Flip chip devices; Frequency conversion; Plastic packaging; Semiconductor device packaging

Indexed keywords

CHIP PADS; PACKAGE ASSEMBLY; PLASTIC PACKAGING; SEMICONDUCTOR DEVICE PACKAGING;

CMOS INTEGRATED CIRCUITS; FLIP FLOP CIRCUITS; FREQUENCY SYNTHESIZERS; HEAT TRANSFER; OPTICAL FREQUENCY CONVERSION; PACKAGING; PHASE LOCKED LOOPS; PLASTICS;

FLIP CHIP DEVICES;

EID: 4444227843     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

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4. th European Solid-State Device Research Conference, pp. 88-94, September 1999.