Thin film analysis in microprocessor manufacturing using Auger electron spectroscopy

Surface and Interface Analysis

Volumn 36, Issue 8, 2004, Pages 837-840

  Dittmar, Kornelia ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

AES depth profiling; Bump; Copper; Linear least square fit; Solder

Indexed keywords

AES DEPTH PROFILING; BUMPS; LINEAR LEAST SQUARE FIT; SOLDER;

AUGER ELECTRON SPECTROSCOPY; CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; COPPER; DATA PROCESSING; FAILURE ANALYSIS; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; OXIDATION; PROCESS CONTROL; SEGREGATION (METALLOGRAPHY); SEMICONDUCTOR DEVICE MANUFACTURE; SILICON NITRIDE; X RAY DIFFRACTION ANALYSIS;

SEMICONDUCTING FILMS;

EID: 4444225737     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/sia.1777     Document Type: Conference Paper

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