Vapor-venting, micromachined heat exchanger for electronics cooling

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 8 PART A, Issue , 2008, Pages 951-960

  David, Milnes P ^a   Khurana, Tarun ^a   Hidrovo, Carlos ^a   Pruitt, Beth L ^a   Goodson, Kenneth E ^a  

^a Stanford University

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; HEAT FLUX; HEAT RESISTANCE; MICROMACHINING; MICROSTRUCTURE; AIR; COOLING; ELECTRONIC COOLING; FLOW OF FLUIDS; HEAT TRANSFER; MICROFLUIDICS; REFRIGERATION; THERMONUCLEAR REACTIONS; TWO PHASE FLOW;

ELECTRONICS COOLING; HIGH-HEAT FLUX REMOVAL; LOW JUNCTION TEMPERATURES; PUMP SIZE; HIGH HEAT FLUX REMOVAL; HYDROPHOBIC MEMBRANE; JUNCTION TEMPERATURES; MEMBRANE LEAKAGES; MICROFLUIDIC COOLING; REFRIGERATION TECHNOLOGY; THERMAL OPERATIONS;

HEAT EXCHANGERS;

EID: 44349168780     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2007-42553     Document Type: Conference Paper

References (28)

1. ITRS Roadmap 2006 Update, http://public.itrs.net/, Aug. 2007.
2. Kandlikar, S. G., et al. (eds.), Handbook of Phase Change: Boiling and Condensation, Philadelphia: Taylor & Francis, 1999, Chp. 16, pp. 405-409.
3. Cancheevaram, J., et al., "Performance of Integrated thinfilm thermoelectrics in cooling "hot-spots" on microprocessors - Experimental setup and results," Mat. Res. Soc. Symp. Proc., Vol. 793, 2004, pp. S8.18.1-S8.18.7.
4. Chen, C., Shakouri, A., "Heat transfer in nanostructures for solid-state energy conversion," J. of Heat Transfer, Vol. 124, No. 2, 2002, pp. 242-252.
5. Phelan, P. E., "Current and future miniature refrigeration cooling technologies for high power microelectronics," IEEE Transaction on Components and Packaging Technologies, Vol. 25, No. 3, 2002, pp. 356-365.
6. Wang, E. N., et al., "Micromachined jets for liquid impingement cooling of VLSI chips," JMEMS, Vol. 13, No. 5, 2004, pp. 833-842.
7. Kercher, D. S., et al., "Microjet cooling devices for thermal management of electronics," IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 2, 2003, 359-366.
8. Brunschwiler, T., et al., "Direct liquid jet impingement cooling with micron sized nozzle array and distributed return architecture," The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, ITHERM '06, San Diego, CA, 30 May - 2 June, 2006, pp. 196-203.
9. Qu, W., Mudawar, I., "Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink," Int. J. of Heat and Mass Transfer, Vol. 45, No. 12, 2002, pp. 2549-2565.
10. Kandlikar, S., Grande, W., "Evaluation of single phase flow in microchannels for high heat flux chip cooling -thermohydraulic performance enhancement and fabrication technology," Heat Transfer Engineering, Vol. 25, No. 8, 2004, pp. 5-16.
11. Garimella, S., Singhal, V., "Single phase flow and heat transport and pumping considerations in microchannel heat sinks," Heat transfer engineering, Vol. 25, No. 1, 2004, pp. 15-25.
12. Jiang, L., Wong, M., Zohar, Y., "Forced Convection Boiling in a MicroChannel Heat Sink," JMEMS, Vol. 10, No. 1, 2001, pp. 80-87.
13. Zhang, L. et al., "Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly Constant Heat Flux Boundary Conditions," JMEMS, Vol. 11, No. 1, 2002, pp. 12-19.
14. Qu, W., Mudawar, I., "Row boiling heat transfer in two-phase micro-channel heat sinks - I. Experimental investigation and assessment of correlation methods," International Journal of Heat and Mass Transfer, Vol. 46, No. 15, July 2003, pp. 2755-2771.
15. Hestroni, G., et al., "A uniform temperature heat sink for cooling of electronic devices," International Journal of Heat and Mass Transfer, Vol. 45, No. 16, July 2002, pp. 3275-3286.
16. Kennedy, J. E., et al., "The onset of flow instability in uniformly heated horizontal microchannels," J. of Heat Transfer, Vol. 122, No. 1, 2000, pp. 118-125.
17. Wu, H. Y., Cheng, P., "Boiling instability in parallel silicon microchannels at different heat flux," Int. J. of Heat and Mass Transfer, Vol. 47, No. 17-18, 2004, pp. 3631-3641.
18. Zhou, P., Goodson, K. E., Santiago, J., U.S. Patent 6,994,151 B2, 2006.
19. Brissette, F., Matlab Steam Table, 2005, Montreal, Canada.
20. Yang, Z., et al., "A prototype of ultrasonic micro-degassing device for portable dialysis system," Sensors and Actuators A, Vol. 95, 2002, pp. 274-280.
21. Meng, D.D. et al, "A Degassing plate with hydrophobic bubble capture and distributed venting for microfluidic devices," J. of Micromech. Microeng., Vol. 16, 2006, pp. 419-424.
22. Lamers, T. L., et al., "Application of a modified quality function deployment method for MEMS," 2007 ASME IMECE, Seattle WA, November 11-15, 2007, Paper IMECE2007-42374.
23. Syed, H. Z., Hackam, R., "Effects of water salinity, electric stress and temperature on the hydrophobicity of polytetrafluoroethane", IEEE Conference on electrical insulation and dielectric phenomena, 1998 - Annual Report, Atlanta GA, Oct. 25-28, 1998, pp. 100-103.
24. Tokoro, T., Hackam, R., "Loss and recovery of hydrophobicity, surface energies, diffusion coefficients and activation energy of nylon", IEEE Transactions on dielectrics and electrical insulation, Vol. 6, No. 5, 1999, pp. 754-763.
25. Feng, L., et al., "Superhydrophobicity of Nanostructured Carbon Films in a wide range of pH values," Angew. Chem. Int. Ed., Vol. 42, 2003, pp. 4217-4220.
26. Li, S., et al., "Superhydrophobicity of large area honeycomb like aligned carbon nanotubes," J. Phys. Chem. B, Vol. 106, 2002, pp. 9274-9276.
27. Lau, K., et al., "Superhydrophobic Carbon Nanotube Forests," Nano Letters, Vol. 3, No. 12, 2003, 1701-1705.
28. Feng, X., et al., "Reversible Super-Hydrophobicity to Super-Hydrophilicity transition of aligned ZnO nanorod films," J. Am. Chem. Soc., Vol. 126, 2004, 62-63.