Equal channel angular extrued Bi0.5Sb1.5Te 3 thermoelectric compound

Materials Transactions

Volumn 49, Issue 4, 2008, Pages 889-891

  Lim, CheolHo ^a   Kim, KyungTaek ^b   Kim, YongHwan ^b   Lee, ChangHun ^a   Lee, ChiHwan ^a  

^a Inha University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

Author keywords

Bi2Te3; Equal channel angular extrusion; Thermoelectric

Indexed keywords

ELECTRIC CONDUCTIVITY; GRAIN SIZE AND SHAPE; PARAMETER ESTIMATION; SEEBECK COEFFICIENT; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

CHANNEL ANGULAR EXTRUSION (ECAE); THERMOELECTRIC PROPERTIES;

BISMUTH COMPOUNDS;

EID: 44349086432     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MEP2007297     Document Type: Article

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