Microstructure and thermoelectric properties of p-type Bi0.5Sb0.5Te0.5 compounds fabricated by hot pressing and hot extrusion

Scripta Materialia

Volumn 38, Issue 3, 1998, Pages 477-484

  Seo, J ^a   Park, K ^b   Lee, D ^a   Lee, C ^a,c  

^a Inha University   (South Korea)

^b Chungju National University   (South Korea)

^c Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DENSITY (SPECIFIC GRAVITY); ELECTRIC PROPERTIES; EXTRUSION; FABRICATION; HOT PRESSING; THERMAL EFFECTS;

GRAIN REFINEMENT; THERMOELECTRIC PROPERTIES;

BISMUTH COMPOUNDS;

EID: 0032488466     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00463-6     Document Type: Article

References (6)

1. R. W. G. Wyckoff, Crystal Structure, Vol. 2, Interscience Publishers, New York (1964).
2. J. R. Weise and L. Muller, J. Phys. Chem. Solids. 15, 13 (1960).
3. Y. M. Yim and F. D. Rosi, Solid State Electronics. 15, 1121 (1972).
4. D. M. Rowe, Applied Energy. 24, 139 (1986).
5. J. P. Fleurial, L. Gailliard, R. Triboulet, H. Scherrer, and S. Scherrer, J. Phys. Chem. Solids. 49, 1237 (1988).
6. K. Uemura and I. Nishida, Thermoelectric Semiconductors and Their Application, Nikkan-Kogyo Shinbun Press, Tokyo, Japan (1988).