The role of vicinal ∑3 boundaries and ∑9 boundaries in grain boundary engineering

Journal of Materials Science

Volumn 40, Issue 12, 2005, Pages 3243-3246

  Randle, V ^a   Hu, Yan ^a  

^a SWANSEA UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER ALLOYS; CRYSTALLOGRAPHY; ELECTROMAGNETIC WAVE BACKSCATTERING; INTERFACES (MATERIALS); MATHEMATICAL MODELS; NICKEL ALLOYS; SILVER ALLOYS; SUPERALLOYS; SURFACE TREATMENT;

ELECTRON BACKSCATTER DIFFRACTION (EBSD); GRAIN BOUNDARY ENGINEERING; GRAIN BOUNDARY STRUCTURE; SINGLE-SURFACE TRACE ANALYSIS;

GRAIN BOUNDARIES;

EID: 20644460132     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-2692-2     Document Type: Conference Paper

References (13)

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