Lumped passive circuits for 5GHz embedded test of RF SoCs

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn 1, Issue , 2004, Pages

  Yoon, Jangsup ^a   Eisenstadt, William R ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALOG SIGNALS; LUMPED-PASSIVE BALUNS; PASSIVE CIRCUIT DESIGN; SYSTEM-ON-A-CHIP (SOC);

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC LINES; EQUIVALENT CIRCUITS; LOCAL AREA NETWORKS; MICROPROCESSOR CHIPS;

PASSIVE NETWORKS;

EID: 4344715537     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. D.E. Bockelman and W.R. Eisenstadt, "Pure-mode network analyzer for on-wafer measurements of mixed-mode S-parameters of differential circuits" IEEE Transactions MTT, pp.l071-1077, 1997.
2. D.E. Bockelman and W.R. Eisenstadt, "Combined differential and common-mode scattering parameters: theory and simulation" IEEE Transactions MIT, pp. 1530-1539, 1995.
3. D.E. Bockelman and W.R. Eisenstadt, "Direct measurement of crosstalk between integrated differential circuits" IEEE Transactions MTT, pp. 1410-1413,2000.
4. S.J. Parisi, "180° Lumped Element Hybrid," IEEE IMS Digest, pp. 1243-1246, 1989.
5. T.Y Song; "Design of a novel lumped element backward directional coupler based on parallel coupled-line theory" Microwave Symposium Digest, 2002 IEEE MTT-S International, pp. 213-216, 2002.