Scatterometry feasibility studies for 0.13-micron flash memory lithography applications; Enabling integrated metrology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5375, Issue PART 1, 2004, Pages 307-316

  Lensing, Kevin ^a   Miller, Clint ^a   Chudleigh, Geoff ^a   Swain, Bryan ^b   Laughery, Michael ^b   Viswanathan, Anita ^c  

^a FASL LLC Fab25

^b Timbre Technologies Inc   (United States)

^c Tokyo Electron America ^*  (United States)

Author keywords

Advanced process control (apc); Aluminum interconnect; Integrated metrology (im); Poly gate; Scatterometry; Shallow trench isolation (sti); Stacked gate

Indexed keywords

ADVANCED PROCESS CONTROL (APC); ALUMINUM INTERCONNECTS; INTEGRATED METROLOGY (IM); POLY GATES; SCATTEROMETRY; SHALLOW TRENCH ISOLATION (STI); STACKED GATES;

ALGORITHMS; COMPUTER SOFTWARE; DATA ACQUISITION; FLASH MEMORY; MEASUREMENT THEORY; PHOTOLITHOGRAPHY; REFLECTOMETERS; ROBUSTNESS (CONTROL SYSTEMS); SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS;

PROCESS CONTROL;

EID: 4344698031     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.533813     Document Type: Conference Paper

References (3)

1. K.R. Lensing et al, "Shallow Trench Isolation Scatterometry Metrology in a High Volume Fab," presented at ISSM 2001, San Jose, CA, October 09, 2001, (pages 195-198 in the proceedings).
2. K.R. Lensing et al, "Aluminum Interconnect Etch Process Control Using Scatterometry Technology," presented at ISSM 2002, Tokyo, Japan, October 15, 2001, (pages 175-1778 in the proceedings).
3. J.B. Stirton et al, "LithoCell-Integrated Critical Dimension Metrology," presented at SPIE Microlithography 2003, San Jose, CA, February 28, 2003.